集成电路高端芯片封装的发展史和未来发展方向

讲座名称：集成电路高端芯片封装的发展史和未来发展方向

讲座时间：2019-08-30 10:30:00

讲座地点：北校区东大楼220

讲座人：郭跃进 教授

讲座人介绍：

Dr. Yuejin GUO is a professor at Southern University of Science and Technology. He received Ph.D. degree from Caltech under William GODDARD in 1992, then He worked at Los Alamos National Lab as a postdoctoral research fellow. After that, he worked at Intel for over twenty years. Dr. Guo published two articles in Science, one article in Nature, and one article in PNAS. He participated in and then led Intel’s advanced packaging technologies such as flip chip and organic material-based packaging. Now almost all Intel’s advanced CPUs are housed in the packages developed by Dr. Guo.

讲座内容：

As IC moves to less than 10nm nodes, and Moore`s Law near stops. To improve IC performance, the packaging becomes more important. Here we will review advanced packaging history: from ceramic to organic, from wire-bonding to flip-chip, and to current Fan-Out packaging, 2.5D, and 3D packaging challenges.

主办单位：微电子学院