三维集成的过去和未来

讲座名称：三维集成的过去和未来

讲座时间：2019-08-30 9:30:00

讲座地点：北校区东大楼220

讲座人：张国飙 教授

讲座人介绍：

Dr. Guobiao ZHANG is a professor at Southern University of Science and Technology. He received Ph.D. degree from Berkeley under Chenming HU in 1995. He worked at Texas Instrument for five years before started 3D-ROM INC. Dr. Zhang is an inventor of 3-D memory and 3-D computation. He owns over 100 hundred patents, most of which are the U.S. patents. Intel’s 3D-XPoint and YMTC’s Xtacking used Dr. Zhang’s patented technologies.

讲座内容：

At the 7nm node, transistors do not have many generations to go. As future scaling of transistors is expected to become stalled around year 2026-2030, 3-D Integration is now considered as one of the most promising candidates. The 3-D integration can be carried out at two levels: integrated circuit (IC) level (i.e. monolithic 3D-IC) and packaging level (i.e. 3D-packaing). In this talk, both monolithic 3D-IC and 3D-packaing will be covered by industrial veterans. Several important milestones during the development of the monolithic 3D-IC and 3D-packaing will be discussed.

主办单位：微电子学院